TANAKA Establishes Transfer Technology for its Sintered Gold (Au) Bonding Technology “AuRoFUSE(TM) Preforms”
TOKYO, Mar 3, 2026 – (JCN Newswire via SeaPRwire.com) – TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), a company engaged in the industrial precious metals business of TANAKA, today announced a gold bump*1 transfer technology for the sintered gold (Au) bonding technology “AuRoFUSE™ Preforms.” This technology allows […]



























